Brand: ViTrox, Malaysia
3D AXI
Advanced 3D X-Ray Inspection (AXI) is designed to specially cater to different sizes of PCB assembly to be examined at a micron level with maximum throughput. This translates to increased production efficiency and cost savings for manufacturers.
We’d love to help you boost your production efficiency. Contact us.
_Specifications_
| Allowable Panel Characteristics ** | V810i S2EX | V810i S2 XXL | V810i S2 XLT |
| Maximum panel size | 482 mm x 610 mm (19″x24″) | 660 mm x 965 mm (26″x38″) | 660 mm x 965 mm (26″x38″) |
| Minimum panel size | 76 mm x 76 mm (3″ x 3″ ) | 76 mm x 76 mm (3″ x 3″ ) | 76 mm x 76 mm (3″ x 3″ ) |
| Maximum panel inspectable area | 474 mm x 610 mm (18.7″x24″) | 654 mm x 965 mm (25.75″x38″) | 654 mm x 965 mm (25.75″x38″) |
| Maximum panel thickness | 7 mm (276 mils) | 12.7 mm (500 mils) | 12.7 mm (500 mils) |
| Minimum panel thickness | 0.5 mm (20 mils) | 0.5 mm (20 mils) | 0.5 mm (20 mils) |
| Panel warp | Downside < 3.3 mm; Upside < 1.5 mm | Downside < 3.3 mm; Upside < 3.3 mm | Downside < 3.3 mm; Upside < 3.3 mm |
| Maximum panel weight | 4.5kg | 15kg | 15kg |
| Board top clearance | 50 mm @ 23 µm resolution | 25 mm @ 19 µm resolution | 50 mm @ 19 µm resolution |
| 38 mm @ 19 µm resolution | 15 mm @ 13 µm resolution | 31 mm @ 15 µm resolution | |
| 38 mm @ 10.5 µm# resolution | * Calculated from Board Top surface | 13 mm @ 11 µm resolution | |
| 11 mm @ 11 µm resolution | 31 mm @ 10 µm resolution | ||
| 11 mm @ 6 µm# resolution | 13 mm @ 7.5 µm resolution | ||
| * Calculated from Board Top surface | * Calculated from Board Top surface | ||
| Board bottom clearance | 70 mm | 80 mm | 80 mm |
| Panel edge clearance | 3 mm | 3 mm | 3 mm |
| Panel width tolerance | ±0.7 mm | ±0.7 mm | ±0.7 mm |
| System resolution | 23 µm/19 µm#, 11 µm, 10.5µm, 6µm# | 19 µm/13 µm | 19 µm/15 µm /11 µm/10µm/7.5 µm |
| 100% Press-fit testability | Yes (With PSP2 feature) | Yes (With PSP2 feature) | Yes (With PSP2 feature) |
| Maximum acceptable panel temperatures | 40 Deg C | 40 Deg C | 40 Deg C |
| Power and Environmental | |||
| System footprint (Width X Depth X Height) | 1566 mm x 2145 mm x 1972 mm | 2240 mm x 2460 mm x 1980 mm | 2240 mm x 2460 mm x 1980 mm |
| Weight | ~3500 kg | ~5500 kg | ~6000 kg |
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_SMT Line Solutions_
AXI (Automated X-Ray Inspection) is an important method in electronics manufacturing since it allows for extensive and accurate analysis of printed circuit boards (PCBs). We offer advanced automated X-ray inspection machines that provide precise and efficient quality control solutions. Our automated X-ray inspection machines utilize cutting-edge technology, including 3D X-ray inspection systems, to ensure comprehensive analysis of PCBs.
Equipped with high-resolution X-ray cameras and advanced algorithms, our automated X-ray inspection system can detect a wide range of defects, such as solder joint quality, component misalignment, voids, and hidden electrical shorts. The 3D X-ray inspection system captures detailed images, providing valuable insights into the internal structure and integrity of the PCBs.
Our automated X-ray inspection systems are designed for efficiency and ease of use. With intuitive interfaces and user-friendly software, operating these machines is straightforward. Additionally, these systems offer fast inspection speeds, enabling high throughput and optimizing production efficiency.
Investing in our automated X-ray inspection pcb enhances your quality control processes, ensuring reliable and precise analysis of your PCBs. Experience accurate defect detection and improved product reliability with our advanced automated X-ray inspection systems.